ICT & Software

IC & SENSOR PACKAGING EXPO JAPAN - TOKYO

Listed · aggregator data

Asia s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

February 17, 2027 → February 19, 2027When

Tokyo International Exhibition Center (Tokyo Big Sight)Tokyo, Japan

No official source confirmed yet — listed from aggregator data. Always verify before booking travel.

Last verified Nov 6, 2026 · source: eventseye